Abstract
As two exemplary candidates of wide-bandgap devices, SiC MOSFETs and GaN HEMTs are regarded as successors of Si devices in medium-to-high-voltage (>1200 V) and low-voltage (<;650 V) domains, respectively, thanks to their excellent switching performance and thermal capability. With the introduction of 650 V SiC MOSFETs and GaN HEMTs, the two technologies are in direct competition in <;650 V domains, such as Level 2 battery chargers for electric vehicles (EVs). This study applies 650 V SiC and GaN to two 240 VAC/7.2 kW EV battery chargers, respectively, aiming to provide a head-to-head comparison of these two devices in terms of overall efficiency, power density, thermal performance, and cost. The charger essentially is an indirect matrix converter with a dual-active-bridge stage handling the power factor correction and power delivery simultaneously. These two chargers utilise the same control strategy, varying the phase-shift and switching frequency to cover the wide input range (80-260 VAC) and wide output range (200 V-450 VDC). Experimental results indicated that at the same efficiency level, the GaN charger is smaller, more efficient and cheaper, while the SiC charger has a better thermal performance.
Original language | American English |
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State | Published - Aug 18 2018 |
Event | IEEE Xplore - Duration: Aug 30 2018 → … |
Conference
Conference | IEEE Xplore |
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Period | 8/30/18 → … |
Keywords
- Battery chargers
- Battery powered vehicles
- Electric vehicle charging
- Gallium compuounds
- HEMT integrated circuits
- III-V semiconductors
- Matrix convertors
- MOS integrated circuits
- Power factor correction
- Power integrated circuits
- Silicon compounds
- Switching convertors
- Wide band gap semiconductors
Disciplines
- Electrical and Computer Engineering